Breakthrough Developments in AOI Technology:
Nordson YESTECH’s FX-940 ULTRA 3D AOI
Nordson YESTECH’s FX-940 ULTRA 3D AOI combines advanced 2D and 3D imaging technology to provide a superior inspection solution. The FX-940 ULTRA boasts improvement and increased throughput by way of:
- Greatly improved defect identification levels
- True solder joint volume measurement
- Verification of correct part assembly
- > 50% reduction in false calls
A unique feature to the FX-940 ULTRA is that it can be configured for all line positions, and is equally effective for paste, pre / post-reflow and final assembly inspection. Additionally, the programming can now be accomplished off-line using a bare board, so the need for a completed assembly is no longer required for a good portion of the programming.
The addition of the 3D technology complements the 2D capabilities of the machine by providing precise measurement of the following:
- Co-planarity of QFNs, BGAs, connectors and other height sensitive devices
- Solder defects / fillet shape / paste
- Lead defects / lifted leads
- Component presence and position
- Correct part / polarity markings
- Through-hole parts
Under the hood, the FX-940 ULTRA’s hardware/software systems come together to create a new standard in automated inspection technology.
PRODUCT FEATURES
- Multi-view 3D sensors with parallel projection for faster inspection times
- 1 top-down and 4 side viewing 2D cameras for defect review
- Automatic programming tools: < 30 minutes to create complete inspection program
- Advanced 2D and 3D rules and image based inspection tools
- SPC data collection and reporting
Learn more about Nordson Yestech: www.nordson.com/en/divisions/yestech