Step Stencils

Multi-level stencils, also known as “step” stencils, are developed using multiple techniques to improve stencil printing.  Mixed steps (up & down) have become an important component of stencil printing because, when adjusting aperture sizes and stencil thickness fails to optimize solder paste volumes, step stencils “step up to the plate” to meet the challenge.

How do step stencils work?

First, relief areas can be welded or etched into the board side of the foil for use over labels and other non-planar PCB features.  This design improves gasketing, minimizing paste bridging and space violations.

Foil top side step options include the ability to step up and, or down to address the varied paste volume requirements of a given design.  A controlled step transition zone ensures a smooth print with no squeegee damage.


  • Regulates solder paste volumes for optimal soldering results over a wider range of component types and sizes.
  • Improved gasketing for better print edge acuity.
  • Reduction of in process stencil cleaning frequency

To learn more about the use of step stencils on densely populated assemblies,

download this white paper by BlueRing Stencils

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